Methodology for Thermal Analysis Applied to Electrical Equipment
- Kitty Urbano(corresponding author),
- ,
- ,
- Rosalynn Ornella Flores-Castameda,
- Miryam Cosme,
- Percy Castro
- ,
- Universidad Privada del Norte,
- Universidad ESAN,
- Universidad César Vallejo,
- Universidad Tecnológica del Perú,
- Universidad Autónoma de Ica
Publication Information
Output type
Original language
EnglishPages from-to (Number of pages)
Pages 752-755 (4 pages)Publication milestones
- Published - 2025
Publication status
Publisher
Institute of Electrical and Electronics Engineers Inc.Publication series
- Publication series name: Proceedings of 5th International Conference on Soft Computing for Security Applications, ICSCSA 2025
ISBN (Electronic)
9798331594916Publication IDs
- Scopus: 105018461202
Host publication title
Proceedings of 5th International Conference on Soft Computing for Security Applications, ICSCSA 2025Abstract
The thermal keys, are the most used mechanisms to be able to control the consumption of current, as much for the houses as for the industries, its maintenance is of vital importance to offer security, exist many mechanisms to be able to make the maintenance of the thermal keys, where they suffer a natural wear by the own use and by the interaction with the current, this effect causes a natural wear of the device, as mechanism of security and control, to be able to verify the correct operation of the device, we present a methodology to be able to monitor the correct operation of the thermal keys as well as to be able to detect any defect or malfunction, through the use of thermal images, where a malfunction will present a variation in the coloration and temperature of operation, as results we present the mode of operation of the methodology, as well as examples of use and operation, finally as a conclusion we present some recommendations to be able to replicate and scale the methodology to other applications.
